First, fix the light-emitting crystal element on the PCB board using a solidification machine, and then perform SMT process on the driving surface to solder the driving IC, capacitors, resistors, and other components on the back of the PCB. After completing the above two processes, conduct AOI inspection on the product, identify defects, and automatically repair them through a repair machine.
After repairing, the surface of the light-emitting surface is glued and molded, followed by ink color testing to ensure consistency of ink color for the same batch of screens. Then, high-precision cutting is performed to remove excess process edges, and finally module assembly is carried out.